• Powered by a MicroSemi SmartFusion2 SoC with a dedicated MCU for power management and telemetry
  • High-speed LVDS interface for payload data; I2C support for low-speed transmissions
  • Operates in 2200-2290 MHz EESS/SRS/SOS spectrum
  • In-flight configurable RF parameters for optimised throughput during overpasses
  • I2C and CAN watchdog implementation
Dedicated MCU for power management & telemetry
In-flight configurable RF parameters
Powered by a MicroSemi SmartFusion2 SoC

Product Specification

Mass

<140g

Dimensions

98.81 x 93.26 x 14.52 mm

Operational Temperature

-20 to +50°C

Frequency Range

2200-2290 MHz

Frequency Step Size

1 kHz

Frequency Stability

±10 ppm

RF Output Power

27 to 33 dBm (settable) ± 1 dB

Spurious Emissions

< -60 dBc

Transmitted Data Rate (on-air)

Up to 10 Mbit/s (5 Msym/s, OQPSK)

Useful information Bit Rate

>10 dB up to 4.3 Mbit/s (at TM transfer frame level), settable in 6 steps

Modulation Scheme

Suppressed Carrier: BPSK, OQPSK as per CCSDS 401.0-B

Pulse Shaping Filter

Root raised cosine Nyquist pulse shaping as per CCSDS 413.0-G.
Roll-off: 0.35/0.5 selectable

Forward Error Correction
Convolutional (K=7, ½) as per CCSDS 131.0-B
Reed Solomon (223, 255) as per CCSDS 131.0-B
Pseudorandomisation

As per CCSDS 131.0-B

Synchronisation
32-bit Attached Sync Marker as per CCSDS 131.0-B
Power Consumption

13 W (for 33 dBm RF output power)

DC Supply Voltage

7 to 20 V

Payload Data Interface

LVDS

Housekeeping Data Interface

I2C

Qualification and Acceptance Testing

QT

Is performed on the design/qualification model

AT

Is performed on the unit to be shipped

Functional Test Checked Checked
Thermal Vacuum Checked Unchecked
Thermal Cycling Checked Checked
Vibration Test Checked Unchecked
Mechanical Shock Test Unchecked Unchecked

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